February 2010

Product Brands. To help our customers identify our core product ranges, we are pleased to announce the following brands:

Supershield^®, a range of high performance electrically conductive silicone and fluorosilicone gasket materials that provide EMI shielding and environmental sealing

Multishield^®, a composite material which combines excellent shielding properties with an efficient environmental seal.

Weaveshield^®, a thin gasket material consisting of silicone, fluorosilicone or neoprene elastomer.

Twinshield^®, a combination gasket consisting of a knitted wire mesh bonded to a non-conductive elastomer strip.

Acushield^®, a range of electrically conductive and environmental form in place (FIP) gaskets that can be directly applied to intricate components for EMI shielding and environmental sealing

Bondshield^®, a range of structural and flexible electrically conductive adhesives that can be used for EMI shielding and grounding.

Vushield^®, a range of windows and display filters that shield against EMI and can offer environmental sealing to IP68 

June 2009

ISO 9001:2008 Certification. To reinforce our commitment to providing the highest levels of customer service, Shielding Solutions is pleased to announce the successful completion of our quality systems program and certification to ISO9001:2008 standards.

September 2008

New Facilities. Shielding Solutions has expanded and moved to a newly refurbished building with a purpose built 'Lab' area for more delicate and sensitive manufacturing procedures and a dedicated Form-in-place production area.
 

Thermal management products. Shielding Solutions has expanded its range of products and services to include support with thermal management issues.  In terms of overall electrical performance, we recognize the complimentary relationship of EMI shielding and Thermally conductive products and are now supplying and developing thermal gap fillers, putties, greases and insulator materials to support the diverse needs of the electronics market.

Shielding Solutions announces a new high temperature shock/stress resistant conductive epoxy ECA-SE002. This adhesive has been developed for applications where thermal shock or thermal cycling may lead to bond failures with conventional conductive epoxy adhesives. It is particularly suited to bonding materials with dissimilar thermal coefficients of expansion it is ideally suited to applications such as bonding glass or polymer EMI windows into aluminium panels/frames. Its high electrical and thermal conductivity combined with room temperature curing also make it suitable for connecting heat sensitive components on to PCBs.